2 MYCRONIC placement machines
Our equipment can place components down to 01005 and work with fine pitches down to 0.3 mm. Our machines can assemble BGA, LGA and QFN packages.
Our workshop combines solder paste jetting, automated SMT placement, vapour-phase reflow and THT operations. We can work with PCBs without tooling rails, fine pitches and complex component packages.
MYCRONIC jetting
The jetting machine deposits solder paste precisely without requiring a stencil. This flexibility is particularly well suited to prototypes and non-standard boards, including those without tooling rails.
Deposit volume, spacing and geometry are still assessed for each board.
Vapour-phase reflow oven
As a heat-transfer fluid condenses, it transfers latent heat to the assembly, promoting even heating despite differences in thermal mass.
The vapour temperature is set by the fluid's boiling point. The reflow profile controls the temperature rise and time above the alloy's liquidus temperature.
Key capabilities.
- PCB sizes
- 5 x 5 mm to 610 x 460 mm
- Construction
- Up to 32 layers
- Materials
- FR4, CEM and Rogers
- Types
- Rigid, flex and rigid-flex
- Components
- Down to 01005
- Fine pitch
- Down to 0.3 mm
- Packages
- BGA, LGA and QFN...
- Assembly
- SMT, THT and press-fit
5000
components per hour / placement machine
THT and press-fit.
We insert and solder THT through-hole components and insert press-fit connectors into the PCB without soldering.
PCBs without tooling rails.
Our equipment, particularly jetting, gives us the flexibility to assemble boards without tooling rails.