Prototype
Get 1 to 10 assembled boards to validate an initial revision, check electrical interfaces and confirm power supplies, communications and critical functions.
Critical points can be inspected on the first board before continuing the batch.
Have a prototype to test, a new revision to assemble or a deadline to meet? We work with you to prepare SMT and through-hole assembly of your electronic boards in our Martillac workshop. Using your bill of materials (BOM), Gerber files and Pick & Place data, we prepare the machine and jetting programmes before sourcing even begins.


On arrival, the PCBs, components and any additional supplies are grouped in a single bin assigned to the project. The bin carries the project's internal reference to prevent mix-ups and maintain traceability.
The team checks the part numbers, quantities, condition and packaging of incoming supplies. Each component part number is then identified and linked to the project before use in production. Particular attention is paid to moisture-sensitive components and opened packaging.
We check that each component matches its PCB lands. This check uses a 2D model of the electronic board in our placement machine software.
Jetting deposits solder paste precisely on the PCB. There is no screen-printing stencil to manufacture. That means one less step and one less cost to get your prototype into production.
Components are prepared in packaging compatible with our equipment. When they arrive loose, we create pockets tailored to the components using an ESD-safe material.
The board then undergoes vapour phase reflow. The cycle is prepared according to the alloy, materials and thermal masses. We develop a dedicated reflow profile for your boards when needed.
We insert and solder connectors and other through-hole components (THT). We also handle lead trimming and forming, as well as manual finishing.
Inspections follow IPC-A-610 Class 2 criteria. Each board is examined under a microscope to inspect accessible joints. Tests agreed with the client follow the defined procedure. X-ray inspection is always used when solder joint quality and wetting cannot be verified under the microscope, particularly for hidden connections.
Boards are wrapped in antistatic bubble wrap. Recycled paper provides additional protection, and the boards are then packed in double-wall cardboard boxes. Express shipping guarantees delivery on the next working day after collection.
Get 1 to 10 assembled boards to validate an initial revision, check electrical interfaces and confirm power supplies, communications and critical functions.
Critical points can be inspected on the first board before continuing the batch.
We assemble small runs of 10 to 500 boards from an approved manufacturing file. Part numbers, variants, revision indices, assembly instructions and inspections are defined before production starts to ensure repeatability across the batch.
With your agreement, we may arrange for a specialist provider to carry out AOI inspection of the assembled boards, according to the defined criteria.
